At EFFRA, Chris Decubber aims at generating consensus on research and innovation priorities among the industrial and research community for the ‘Factories of the Future’ PPP. Chris coordinates the monitoring of the outcome and progress of the ‘Factories of the Future’ PPP and works on knowledge transfer mechanisms that enhance the impact of the FoF PPP. Chris also initiated the ConnectedFactories Coordination Action which focuses on the developing pathways to the digitalisation of manufacturing.
EFFRA – The European Factories of the Future Research Association (EFFRA) is an industry-driven association promoting the development of new and innovative production technologies. It is the official representative of the private side in the ‘Factories of the Future’ public-private partnership under Horizon 2020. The partnership aims at bringing together private and public resources in an industry-led research and innovation programme that generates and demonstrates technologies for a wide range of manufacturing sectors.
Talk Title: Pathways to Digitalisation of Manufacturing
Pathways to digitalisation of manufacturing reflect how digitalisation and eventually the deployment of digital platforms can bring value within different kinds of manufacturing perspectives, such as factory automation, value networks or product-service development. The pathways enhance the awareness among different stakeholders about the actual and future use of digital technologies in manufacturing and facilitate the migration from legacy situations towards innovative approaches.
Dr. Michael Karner is lead researcher for Embedded Systems at VIRTUAL VEHICLE in Graz, Austria. He received a master’s (Information and Computer Engineering) and doctoral degree (Electrical Engineering) from Graz University of Technology. He has been active as project manager for the ARTEMIS project DEWI (focussing on dependable wireless infrastructure), with a budget of 40M€ and involving nearly 60 partners from 11 European countries. Currently, he is the coordinator for the successor ECSEL project SCOTT (focussing on cost-efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability in the Internet of Things), with a budget of 40M€ and involving nearly 60 partners from 11 European countries and Brazil). He has more than ten years industrial and scientific research experience in the field of wireless systems, communication networks and protocols, automotive electrics/electronics and software, cooperative safety systems as well as co-simulation. Furthermore, he is active as a reviewer and technical program committee member in several conferences and journals.
Talk Title: Boosting Security, Privacy, Safety, and Trust in the Internet of Things
Creating trust in wireless solutions and increasing their social acceptance are major challenges to achieve the full potential of the Internet of Things. Therefore, the ECSEL project SCOTT – Secure COnnected Trustable Things, a pan-European effort with 57 key partners from 12 countries (EU and Brazil), will provide comprehensive cost-efficient solutions of wireless, end-to-end secure, trustworthy connectivity and interoperability (Technology Readiness Level 6-7) to bridge the last mile to market implementation. SCOTT will not just deal with ‚things that are connected‘, but with ‚trustable things that securely communicate‘, i.e. things interconnected by dependable wireless technology and valuing the end-users‘ privacy rules.
The presentation will give an overview about the SCOTT key innovation activities:
- Boosting Security, Privacy, Safety and Trust for IoT
- Ensuring Industry-compliant Connectivity via Cloud Integration
- Developing Innovative Energy-constrained and Autonomous IoT Components
- Providing a Reference Architecture for Secure Connected Trustable Things demonstrated across 5 Domains
- Design a scientifically sound yet practical Framework for developing Trusted Systems
Furthermore, results of the 15 different use cases will be presented, showing the disruptive impact of the SCOTT innovations within and across various industrial domains.
Danilo Pietro Pau graduated at Politecnico di Milano, Italy on 1992 in Electronic Engineering. On 1991 he joined STMicroelectronics, Advanced System Technology and worked on many R&D projects involving processing technologies such as video coding, embedded graphics, computer vision and deep learning with the aim of bringing them into company products. Currently he holds Senior Principal Engineer, Member of Technical Staff position. He co-founded and served as Chairman the STMicroelectronics Technical Staff Italy Community on 2012. He is also IEEE Senior Member, serves IEEE as Industry Ambassadors for IEEE Region 8 South Europe and being vice chair of Task Force on “Intelligent Cyber-Physical Systems” within IEEE Computational Intelligence Society.
Talk Title: STMicroelectronics at the edge of Intelligent Cyber-Physical-Systems Theory, Practice, Deployment
Cyber-Physical Systems (CPS) are becoming, without pace, deeply pervasive into embedded systems. Artificial Intelligence, Machine Learning and Deep Learning were mostly confined into the cloud, in which unlimited computing resources are available and evolving tirelessly. Unfortunately a layered architecture in which dumb edge sensing units are attached to the cloud would become quickly too centralized, poorly scalable and slowly responsive in the future. That is true in the context of the IoT expected scenario that will deploy hundreds of billions of sensing units communicating through ultra low data rate networks.
In that context, STMicroelectronics is developing solutions to bring Artificial Intelligence into the sensing units.
This talk will cover STMicroelectronics Artificial Intelligent solutions and devices under development and publicly announced. The talk will tell how they represent the key ingredients needed to design the current and future generation of artificial intelligent cyber-physical embedded systems to derive break-through applications based on STMicroelectronics heterogeneous sensors, micro controllers and SoC. In particular, aspects related on how address current interoperability, productivity and constrained embedded resource gaps will be discussed with practical examples and demonstrations.
Moreover the investigation and design of adaptive and cognitive computational-intelligence techniques able to learn, adopting artificial neural networks and operate in nonstationary environments and the deployment of credible networked intelligent cyber-physical systems able to operate in time varying environments will be introduced.